Using CAD, CIL can design the BGA substrate in either laminate or ceramic technologies and reflow solder the solder balls using a process that has been developed in-house. The bare die or multiple ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break ...

In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...