3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is ...
Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...
Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...
Version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator is now available from EMA Design Automation. Version 2.0b contains over 200 time-domain simulation models for power ...
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