The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...

Japanese researchers have developed an accelerated testing method to quickly and accurately determine if harmful chemicals ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Opinions expressed by Entrepreneur contributors are their own. Today, customers order most of what they need to their doorstep, from groceries to cosmetics to pet products. And they expect these ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...