Is Applied Materials (AMAT) Quietly Rewiring Its AI Moat With New DRAM And Packaging Tools?

In recent days, Applied Materials introduced a new epitaxy system for DRAM, plus CMP, deposition and eBeam tools aimed at ...
Business Wire

Applied Materials Releases the Industry’s Most Advanced, Productive CMP Platform – the Reflexion GT

TOKYO--(BUSINESS WIRE)--Applied Materials, Inc. today raised CMP * technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied Reflexion ® GT system for ...
EDN

Applied Materials upgrades CMP for sub-100-nm

SANTA CLARA, Calif. — Applied Materials, Inc. has a fixed-abrasive chemical mechanical planarization (CMP) system for forming the shallow trench isolation (STI) structures in sub-100nm devices. The ...

Applied Materials (AMAT) Expands AI Chip Tools With New DRAM And 3D Packaging Systems

Applied Materials (NasdaqGS:AMAT) announced a major expansion of its product suite focused on next generation AI chip ...
EDN

Soitec selects Applied’s CMP technology for 300-mm SOI wafers

BERNIN, France — Soitec SA, a supplier of silicon-on-insulator (SOI) wafers, has selected Applied Materials' 300-mm Reflexion chemical mechanical polishing technology to help it manufacture Unibond ...
Shanghai Metals Market

[Applied Materials releases series of 3D manufacturing equipment for AI chips targeting HBM stacking process]

Applied Materials unveiled a product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses o ...
DATAQUEST

Applied Materials intros new systems to accelerate 3D architectures powering AI chips

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...